The Microchip Encapsulation with Autodesk® Moldflow® Insight 2017 training material discusses the simulations capabilities involving microchip encapsulation. The course emphasizes the modeling, setup and results interpretation of the various analyses that can be done. The exercises relate to the skills necessary to perform the needed analyses.
Topics Covered:
- Microchip encapsulation molding overview.
- Modeling wires for microchip encapsulation.
- Modeling paddles for microchip encapsulation.
- Model assembly for microchip encapsulation.
- Analysis setup for microchip encapsulation.
- Compression molding with wire sweep.
- Results interpretation of microchip encapsulation analyses.
Prerequisites:
This training manual assumes knowledge of the Autodesk® Moldflow® Insight software, including CAD Model importing, and meshing. Refer to Autodesk® Moldflow® Insight 2017: Fundamentals or its equivalent for more information on these subjects.
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