The Autodesk® Moldflow® Insight 2021: Underfill Encapsulation training material discusses the underfill encapsulation process used in the electronics industry. Discussions include an overview of the underfill encapsulation process and material, and simulating underfill.
Topics Covered:
- Underfill encapsulation overview
- Simulating underfill encapsulation moldin
- Underfill encapsulation materials
Prerequisites:
This training manual assumes knowledge of Autodesk Moldflow Insight, including CAD model importing and meshing. Refer to the Autodesk® Moldflow® Insight 2021: Fundamentals guide for more information on these subjects.
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